BOISE, Idaho and SANTA CLARA, Calif., Feb. 1, 2008 – Intel Corporation and Micron Technology Inc. today unveiled a high speed NAND flash memory technology that can greatly enhance the access and transfer of data in devices that use silicon for storage. The new technology – developed jointly by Intel and Micron and manufactured by the companies' NAND flash joint venture, IM Flash Technologies (IMFT) – is five times faster than conventional NAND, allowing data to be transferred in a fraction of the time for computing, video, photography and other computing applications.
The new high speed NAND can reach speeds up to 200 megabytes per second (MB/s) for reading data and 100 MB/s for writing data, achieved by leveraging the new ONFI 2.0 specification and a four-plane architecture with higher clock speeds. In comparison, conventional single level cell NAND is limited to 40 MB/s for reading data and less than 20 MB/s for writing data.
"Micron looks forward to unlocking the possibilities with high speed NAND," said Frankie Roohparvar, Micron vice president of NAND development. "We are working with an ecosystem of key enablers and partners to build and optimize corresponding system technologies that take advantage of its improved performance capabilities. Micron is committed to NAND innovation and designing new features into the technology that create a powerful data storage solution for today's most popular consumer electronic and computing devices."
"The computing market is embracing NAND-based solutions to accelerate system performance through the use of caching and solid-state drives," said Pete Hazen, director of marketing, Intel NAND Products Group. "At up to five times the performance over conventional NAND, the high speed NAND from Intel and Micron, based on the ONFi 2.0 industry standard, will enable new embedded solutions and removable solutions that take advantage of high–performance system interfaces, including PCIe and upcoming standards such as USB 3.0."
For example, the specific performance advantages of high speed NAND in today's most popular devices include:
When used in a hybrid hard drive, high speed NAND can allow the system to read and write data anywhere between two or four times the speed when compared to conventional hard drives.
With the popularity of digital video cameras and video on demand services, high speed NAND can enable a high-definition movie to be transferred five times faster than conventional NAND.
With the pending USB 3.0 interface, high speed NAND is expected to effectively deliver on the increased data transfer rates of the new specification, where conventional NAND would act as the bottleneck in system performance. USB 3.0 is aiming for 10 times the bandwidth of current USB 2.0 solutions, or approximately achieving 4.8 gigabits per second.
As NAND continues to move into the PC platform, the Non-Volatile Memory Host Controller Interface (NVMHCI) can take advantage of high speed NAND in solutions such as Intel® Turbo Memory, allowing for even better system performance. NVMHCI is designed to provide a standard software programming interface allowing operating system drivers to access NAND flash memory storage in applications such as hard drive caching and solid-state drives.
Friday, March 14, 2008
Intel, STMicroelectronics Deliver Industry's First Phase Change Memory Prototypes
SANTA CLARA, Calif and GENEVA, Feb. 6, 2008 – Intel Corporation and STMicroelectronics reached a key industry milestone today as they began shipping prototype samples of a future product using a new, innovative memory technology called Phase Change Memory (PCM). The prototypes are the first functional silicon to be delivered to customers for evaluation, bringing the technology one step closer to adoption.
The memory device, codenamed "Alverstone" uses PCM, a promising new memory technology providing very fast read and write speeds at lower power than conventional flash, and allows for bit alterability normally seen in RAM. PCM has long been a topic of discussion for research and development, and with "Alverstone," Intel and STMicroelectronics are helping to move the technology into the marketplace.
"This is the most significant non-volatile memory advancement in 40 years," said Ed Doller, chief technology officer-designate of Numonyx, the new name for the pending STMicroelectronics and Intel flash memory company. "There have been plenty of attempts to find and develop new non-volatile memory technologies, yet of all the concepts, PCM provides the most compelling solution – and Intel and STMicroelectronics are delivering PCM into the hands of customers today. This is an important milestone for the industry and for our companies."
In related news, Intel and STMicroelectronics technologists presented a research paper this week at the International Solid States Circuits Conference (ISSCC) describing yet another breakthrough in PCM technology. Together, the companies created the world’s first demonstrable high-density, multi-level cell (MLC) large memory device using PCM technology. The move from single bit per cell to MLC also brings significantly higher density at a lower cost per Mbyte making the combination of MLC and PCM a powerful development.
In 2003, Intel and STMicroelectronics formed a joint development program (JDP) to focus on Phase Change Memory development. Previously the JDP demonstrated 8Mb memory arrays on 180nm at the 2004 VLSI conference and first disclosed the Alverstone 90nm 128Mbit memory device at the 2006 VLSI Symposium. Alverstone and future JDP products will become part of Numonyx, a new independent semiconductor company created through an agreement between STMicroelectronics, Intel and Francisco Partners signed in May 2007. The new company's strategic focus will be on supplying complete memory solutions for a variety of consumer and industrial devices, including cellular phones, MP3 players, digital cameras, computers and other high-tech equipment. The companies are scheduled to close the transaction in the first quarter of 2008.
In 2007, the combined memory market for DRAM, flash, and other memory products such as EEPROM was US$61 billion, according to the industry research firm Web-Feet Research, Inc. Memory technology cost declines have traditionally been driven at the rate of "Moore’s Law," where density doubles every 18 months with each lithography shrink. As RAM and flash technologies run into scaling limitations over the next decade, PCM costs will decline at a faster rate. The advent of multi-level-cell PCM will further accelerate the cost per bit crossover of PCM technology relative to today's technologies. Finally, by combining the bit-alterability of DRAM, the non-volatility of flash, the fast reads of NOR and the fast writes of NAND, PCM has the ability to address the entire memory market and be a key driver for future growth over the next decade.
Alverstone is a 128Mb device built on 90nm and is intended to allow memory customers to evaluate PCM features, allowing cellular and embedded customers to learn more about PCM and how it can be incorporated into their future system designs.
The memory device, codenamed "Alverstone" uses PCM, a promising new memory technology providing very fast read and write speeds at lower power than conventional flash, and allows for bit alterability normally seen in RAM. PCM has long been a topic of discussion for research and development, and with "Alverstone," Intel and STMicroelectronics are helping to move the technology into the marketplace.
"This is the most significant non-volatile memory advancement in 40 years," said Ed Doller, chief technology officer-designate of Numonyx, the new name for the pending STMicroelectronics and Intel flash memory company. "There have been plenty of attempts to find and develop new non-volatile memory technologies, yet of all the concepts, PCM provides the most compelling solution – and Intel and STMicroelectronics are delivering PCM into the hands of customers today. This is an important milestone for the industry and for our companies."
In related news, Intel and STMicroelectronics technologists presented a research paper this week at the International Solid States Circuits Conference (ISSCC) describing yet another breakthrough in PCM technology. Together, the companies created the world’s first demonstrable high-density, multi-level cell (MLC) large memory device using PCM technology. The move from single bit per cell to MLC also brings significantly higher density at a lower cost per Mbyte making the combination of MLC and PCM a powerful development.
In 2003, Intel and STMicroelectronics formed a joint development program (JDP) to focus on Phase Change Memory development. Previously the JDP demonstrated 8Mb memory arrays on 180nm at the 2004 VLSI conference and first disclosed the Alverstone 90nm 128Mbit memory device at the 2006 VLSI Symposium. Alverstone and future JDP products will become part of Numonyx, a new independent semiconductor company created through an agreement between STMicroelectronics, Intel and Francisco Partners signed in May 2007. The new company's strategic focus will be on supplying complete memory solutions for a variety of consumer and industrial devices, including cellular phones, MP3 players, digital cameras, computers and other high-tech equipment. The companies are scheduled to close the transaction in the first quarter of 2008.
In 2007, the combined memory market for DRAM, flash, and other memory products such as EEPROM was US$61 billion, according to the industry research firm Web-Feet Research, Inc. Memory technology cost declines have traditionally been driven at the rate of "Moore’s Law," where density doubles every 18 months with each lithography shrink. As RAM and flash technologies run into scaling limitations over the next decade, PCM costs will decline at a faster rate. The advent of multi-level-cell PCM will further accelerate the cost per bit crossover of PCM technology relative to today's technologies. Finally, by combining the bit-alterability of DRAM, the non-volatility of flash, the fast reads of NOR and the fast writes of NAND, PCM has the ability to address the entire memory market and be a key driver for future growth over the next decade.
Alverstone is a 128Mb device built on 90nm and is intended to allow memory customers to evaluate PCM features, allowing cellular and embedded customers to learn more about PCM and how it can be incorporated into their future system designs.
Intel and FREEDOM4 Collaborate to Accelerate Deployment of WiMAX Network in the U.K.
LONDON – Feb. 11, 2008 – In an effort to bring people faster, lower cost and a truly mobile, data broadband technology, FREEDOM4 and Intel Corporation today announced a collaboration to accelerate mobile WiMAX deployment in the U.K. Intel Capital, Intel Corporation's global investment organization, also announced that it has signed an agreement to make a substantial investment in U.K. based FREEDOM4 Limited (“FREEDOM4”), formerly known as Pipex Wireless Limited. Pipex Communications PLC will also join Intel Capital in this investment. This latest investment from Intel Capital and Pipex Communications, a major U.K. based telecommunications provider, follows FREEDOM4's successful WiMAX trials in the U.K.
FREEDOM4 is a pioneer in WiMAX services with broad spectrum assets, which will enable the deployment of WiMAX across the U.K. WiMAX services provided by FREEDOM4 aim to make personal wireless broadband available to both businesses and consumers at affordable prices. WiMAX represents the future of mobile broadband and Intel Capital, along with tremendous support from a worldwide ecosystem, is a leading global investor in WiMAX technology.
"Intel Capital is a major investor in WiMAX technology and is committed to accelerating the deployment of open-standards mobile broadband around the world," said Arvind Sodhani, president of Intel Capital. "FREEDOM4 has built a top-notch management team and this is a strategic investment opportunity through which we can help facilitate the deployment of wireless broadband in the U.K market."
Mike Read, CEO, FREEDOM4 adds, "Following the success of the commercial launch of our services in Milton Keynes, we are in the next phase of our development: making FREEDOM4 the market leader in 'personal' wireless broadband access. The investment from Intel Capital and Pipex Communications will facilitate the roll out of a WiMAX network in other cities around the U.K., providing a truly flexible service to businesses and consumers."
Delivering Mobile WiMAXIntel is a leader in driving the development and deployment of WiMAX, a new wireless broadband technology that delivers "broadband on the go." Mobile WiMAX, based on the IEEE 802.16e industry specification, is a mobile broadband wireless technology that provides low-cost, multi-megabit speed and increased throughput for accessing large amounts of data such as movies and multimedia content. Intel's integrated Wi-Fi/WiMAX module (codenamed "Echo Peak") will debut in certain next-generation Intel® Centrino® processor-based laptops (codenamed "Montevina") beginning in the middle of the year. The company's low-power mobile WiMAX silicon specifically designed for mobile Internet and consumer electronic devices (codenamed "Baxter Peak") will also be available this year.
FREEDOM4 is a pioneer in WiMAX services with broad spectrum assets, which will enable the deployment of WiMAX across the U.K. WiMAX services provided by FREEDOM4 aim to make personal wireless broadband available to both businesses and consumers at affordable prices. WiMAX represents the future of mobile broadband and Intel Capital, along with tremendous support from a worldwide ecosystem, is a leading global investor in WiMAX technology.
"Intel Capital is a major investor in WiMAX technology and is committed to accelerating the deployment of open-standards mobile broadband around the world," said Arvind Sodhani, president of Intel Capital. "FREEDOM4 has built a top-notch management team and this is a strategic investment opportunity through which we can help facilitate the deployment of wireless broadband in the U.K market."
Mike Read, CEO, FREEDOM4 adds, "Following the success of the commercial launch of our services in Milton Keynes, we are in the next phase of our development: making FREEDOM4 the market leader in 'personal' wireless broadband access. The investment from Intel Capital and Pipex Communications will facilitate the roll out of a WiMAX network in other cities around the U.K., providing a truly flexible service to businesses and consumers."
Delivering Mobile WiMAXIntel is a leader in driving the development and deployment of WiMAX, a new wireless broadband technology that delivers "broadband on the go." Mobile WiMAX, based on the IEEE 802.16e industry specification, is a mobile broadband wireless technology that provides low-cost, multi-megabit speed and increased throughput for accessing large amounts of data such as movies and multimedia content. Intel's integrated Wi-Fi/WiMAX module (codenamed "Echo Peak") will debut in certain next-generation Intel® Centrino® processor-based laptops (codenamed "Montevina") beginning in the middle of the year. The company's low-power mobile WiMAX silicon specifically designed for mobile Internet and consumer electronic devices (codenamed "Baxter Peak") will also be available this year.
Intel Delivers 'Hard-Core' Eight-Core Platform for PC Performance Aficionados
GAME DEVELOPERS CONFERENCE, San Francisco, Feb. 19, 2008 – For those who crave more performance than what four processing cores and a single graphics card can deliver today, Intel Corporation has introduced the Intel® Dual Socket Extreme Desktop Platform. Formerly codenamed "Skulltrail," this is one of the first enthusiast desktop platforms to support two Intel quad core processors for a total of eight processing engines and a choice of multi-card graphics solutions from either ATI* or NVIDIA*.
"When it comes to delivering innovation to the ultimate enthusiast, our new 8-core desktop platform is a winner," said Jeff McCrea, senior vice president and general manager of Intel's Digital Home Group. "The ground-breaking Intel Desktop Board D5400XS enables the flexibility to pair a variety of quad graphics solutions with two of our fastest desktop processors. The result is stunning PC performance."
The Intel® Desktop Board D5400XS, when paired with two Intel® Core™ 2 Extreme QX9775 processors, forms the foundation of the Intel Dual Socket Extreme Desktop Platform. Hardcore gamers will welcome the opportunity to enjoy multiple simultaneous graphics card solutions featuring either NVIDIA SLI* or ATI Crossfire* for today's latest graphics-intensive titles. And the performance of eight processing cores is especially welcomed by the 3-D animators, digital audio artists and high-definition video editors behind the coolest games here at the Game Developers Conference.
"For the team creating world-class games here at id, time is one of our most valuable assets," said Robert A. Duffy, Programming Director, id Software. "Having eight powerful Intel cores in a single machine helps our team create and test our latest titles at record speed. We have seen one of our most time-consuming asset generation processes cut from over 4 hours to under 20 minutes by utilizing all eight cores and threading the generation code. Long term this translates to better games on the market faster than previously possible."
As high-definition video becomes more prevalent than ever, encoding and editing is a task that more power users are looking to their PC to do for them. Such workloads are handled with ease by this new platform, and video developers such as DivX* are excited about the possibilities.
"By optimizing our codec to take advantage of these eight cores, we're seeing very impressive performance gains in our labs," said Jerome Vashisht-Rota, co-founder of DivX Inc. "Natively supporting eight core technology allows us to significantly accelerate codec performance for processor intensive applications like the encoding of high-definition video on the PC so that we can continue to offer our users the high-quality digital video experience they have come to expect."
Each Intel Core 2 Extreme processor QX9775 offers 12MB of L2 cache, a fast 1600 MHz system bus and four cores running at a brisk 3.2 GHz. When paired on the dual-socket Intel Desktop Board D5400XS, this platform breezes through modern benchmarks and advanced workloads. For experienced enthusiasts who desire more capability, the Intel Core 2 Extreme processor bus ratio locks (overspeed protection) have been removed**. This offers added technical flexibility in customizing the system so OEMs can unleash even more performance.
"This dual processor platform is the fastest desktop PC we've ever tested in our labs, reaching a score of 6481*** on 3DMark06* CPU and 20,160*** on Cinebench* 10 even while running at the standard 3.20 GHz frequency," says Shervin Kheradpir, director of Intel performance benchmarking.
Pricing and Availability:
The Intel Core 2 Extreme processor QX9775 is available now at an MSRP of $1,499 each. Estimated street pricing for the Intel Desktop Board D5400XS is $649. Platform components are sold separately. Several enthusiast PC manufacturers plan to offer systems based on this new platform starting today and over the next 30 days, including Armari*, Boxx Tech*, Digital Storm*, Falcon Northwest*, Maingear*, Puget Systems*, Scan*, Velocity Micro*, Vigor Gaming*, Voodoo*, @Xi Computers* and others.
"When it comes to delivering innovation to the ultimate enthusiast, our new 8-core desktop platform is a winner," said Jeff McCrea, senior vice president and general manager of Intel's Digital Home Group. "The ground-breaking Intel Desktop Board D5400XS enables the flexibility to pair a variety of quad graphics solutions with two of our fastest desktop processors. The result is stunning PC performance."
The Intel® Desktop Board D5400XS, when paired with two Intel® Core™ 2 Extreme QX9775 processors, forms the foundation of the Intel Dual Socket Extreme Desktop Platform. Hardcore gamers will welcome the opportunity to enjoy multiple simultaneous graphics card solutions featuring either NVIDIA SLI* or ATI Crossfire* for today's latest graphics-intensive titles. And the performance of eight processing cores is especially welcomed by the 3-D animators, digital audio artists and high-definition video editors behind the coolest games here at the Game Developers Conference.
"For the team creating world-class games here at id, time is one of our most valuable assets," said Robert A. Duffy, Programming Director, id Software. "Having eight powerful Intel cores in a single machine helps our team create and test our latest titles at record speed. We have seen one of our most time-consuming asset generation processes cut from over 4 hours to under 20 minutes by utilizing all eight cores and threading the generation code. Long term this translates to better games on the market faster than previously possible."
As high-definition video becomes more prevalent than ever, encoding and editing is a task that more power users are looking to their PC to do for them. Such workloads are handled with ease by this new platform, and video developers such as DivX* are excited about the possibilities.
"By optimizing our codec to take advantage of these eight cores, we're seeing very impressive performance gains in our labs," said Jerome Vashisht-Rota, co-founder of DivX Inc. "Natively supporting eight core technology allows us to significantly accelerate codec performance for processor intensive applications like the encoding of high-definition video on the PC so that we can continue to offer our users the high-quality digital video experience they have come to expect."
Each Intel Core 2 Extreme processor QX9775 offers 12MB of L2 cache, a fast 1600 MHz system bus and four cores running at a brisk 3.2 GHz. When paired on the dual-socket Intel Desktop Board D5400XS, this platform breezes through modern benchmarks and advanced workloads. For experienced enthusiasts who desire more capability, the Intel Core 2 Extreme processor bus ratio locks (overspeed protection) have been removed**. This offers added technical flexibility in customizing the system so OEMs can unleash even more performance.
"This dual processor platform is the fastest desktop PC we've ever tested in our labs, reaching a score of 6481*** on 3DMark06* CPU and 20,160*** on Cinebench* 10 even while running at the standard 3.20 GHz frequency," says Shervin Kheradpir, director of Intel performance benchmarking.
Pricing and Availability:
The Intel Core 2 Extreme processor QX9775 is available now at an MSRP of $1,499 each. Estimated street pricing for the Intel Desktop Board D5400XS is $649. Platform components are sold separately. Several enthusiast PC manufacturers plan to offer systems based on this new platform starting today and over the next 30 days, including Armari*, Boxx Tech*, Digital Storm*, Falcon Northwest*, Maingear*, Puget Systems*, Scan*, Velocity Micro*, Vigor Gaming*, Voodoo*, @Xi Computers* and others.
Intel Ships New Processors for Embedded, Communications and Storage Markets Based on New Transistors, Manufacturing
SANTA CLARA, Calif., Feb. 27, 2008 – Intel Corporation today announced expanded offerings for embedded market segments with new processors with extended, 7-year life cycle support, a new chipset and a carrier-grade server. The processors, based on Intel's revolutionary high-k, metal gate transistor formula and manufactured on the company's 45-nanometer (nm) process, include the Quad-Core Intel® Xeon® processor 5400 Series and Dual-Core Intel® Xeon® processor 5200 Series.
These new processors, coupled with the new power-optimized Intel® 5100 Memory Controller Hub (MCH) chipset, comprise the first 45nm CPU platforms for thermally constrained bladed applications. When using the Intel 5000P chipset, the 45nm processors are ideal for full-performance and memory-intensive applications such as storage, routers, security and medical solutions, as well as communications applications such as IP Multimedia Subsystems (IMS).
The processors take advantage of Intel's Hafnium-based, high-k metal gate transistor formula, which reduces power consumption, increases switching speed and significantly increases transistor density over the company's previous 65nm manufacturing technology. These 45nm CPU-based platforms, based on the Intel® 5100 MCH chipset, are ideal for 200 watt maximum power envelope specifications such as AdvancedTCA* and also for NEBS Level-3 requirements.
"We're acutely aware of the performance demands and power consumption concerns of our customers and reached a remarkable 67 percent more compute performance-per-watt when we validated the Intel 5100 MCH chipset-based 45nm quad-core platform1," said Doug Davis, vice president and general manager of Intel's Embedded and Communications Group. "In addition, the 45nm quad-core processors also allow for a 22 percent performance gain over previous-generation platforms within the same thermal profile2, making it an excellent choice for compute-intensive applications such as IMS and platforms for storage, routers and security."
"Ericsson will introduce its quad-core Intel Xeon Processor-based IMS/Core network nodes and application servers to allow operators and service providers to host more subscribers in a smaller footprint, thus lowering total cost of ownership and environmental impact," said Magnus Furustam, vice president and head of Ericsson's product area Core and IMS. "The processing headroom will also enable the next generation of innovative IMS services. To accelerate this innovation, Ericsson and Intel are promoting the benefits of IMS to the communications developer community globally."
Intel is offering extended lifecycle support for 7 years for the Dual-Core Intel Xeon processor 5200 series (E5240, E5220, L5238) and the Quad-Core Intel Xeon processor 5400 series (E5440 and L5408). This represents an expansion from previous minimum support of 5 years.
The new Intel® Carrier Grade Server TIGH2U building block offers increased choice for customers that require power efficiency and improved compute performance for high-end communication applications. Intel also announced enhancements for the Intel® Carrier Grade Server TIGW1U, Intel® IP Network Server NSW1U and Intel® IP Network Server NSC2U. These reliable communication rack-mount servers now support the Quad-Core Intel® Xeon® processor 5400 Series and are ideal for telco and network applications in harsh environments with NEBS Level-3 requirements that demand high performance, energy efficiency and high I/O throughput.
Pricing and AvailabilityThe 45nm processors with extended lifecycle support are available today, and prices range from $321 to $690. The dual-core Intel Xeon processor L5238 at 35 watts will be available in April. The Intel 5100 MCH chipset is available today, starting at $76.
These new processors, coupled with the new power-optimized Intel® 5100 Memory Controller Hub (MCH) chipset, comprise the first 45nm CPU platforms for thermally constrained bladed applications. When using the Intel 5000P chipset, the 45nm processors are ideal for full-performance and memory-intensive applications such as storage, routers, security and medical solutions, as well as communications applications such as IP Multimedia Subsystems (IMS).
The processors take advantage of Intel's Hafnium-based, high-k metal gate transistor formula, which reduces power consumption, increases switching speed and significantly increases transistor density over the company's previous 65nm manufacturing technology. These 45nm CPU-based platforms, based on the Intel® 5100 MCH chipset, are ideal for 200 watt maximum power envelope specifications such as AdvancedTCA* and also for NEBS Level-3 requirements.
"We're acutely aware of the performance demands and power consumption concerns of our customers and reached a remarkable 67 percent more compute performance-per-watt when we validated the Intel 5100 MCH chipset-based 45nm quad-core platform1," said Doug Davis, vice president and general manager of Intel's Embedded and Communications Group. "In addition, the 45nm quad-core processors also allow for a 22 percent performance gain over previous-generation platforms within the same thermal profile2, making it an excellent choice for compute-intensive applications such as IMS and platforms for storage, routers and security."
"Ericsson will introduce its quad-core Intel Xeon Processor-based IMS/Core network nodes and application servers to allow operators and service providers to host more subscribers in a smaller footprint, thus lowering total cost of ownership and environmental impact," said Magnus Furustam, vice president and head of Ericsson's product area Core and IMS. "The processing headroom will also enable the next generation of innovative IMS services. To accelerate this innovation, Ericsson and Intel are promoting the benefits of IMS to the communications developer community globally."
Intel is offering extended lifecycle support for 7 years for the Dual-Core Intel Xeon processor 5200 series (E5240, E5220, L5238) and the Quad-Core Intel Xeon processor 5400 series (E5440 and L5408). This represents an expansion from previous minimum support of 5 years.
The new Intel® Carrier Grade Server TIGH2U building block offers increased choice for customers that require power efficiency and improved compute performance for high-end communication applications. Intel also announced enhancements for the Intel® Carrier Grade Server TIGW1U, Intel® IP Network Server NSW1U and Intel® IP Network Server NSC2U. These reliable communication rack-mount servers now support the Quad-Core Intel® Xeon® processor 5400 Series and are ideal for telco and network applications in harsh environments with NEBS Level-3 requirements that demand high performance, energy efficiency and high I/O throughput.
Pricing and AvailabilityThe 45nm processors with extended lifecycle support are available today, and prices range from $321 to $690. The dual-core Intel Xeon processor L5238 at 35 watts will be available in April. The Intel 5100 MCH chipset is available today, starting at $76.
Intel Announces Intel® Atom™ Brand for New Family of Low-Power Processors
SANTA CLARA, Calif., March 2, 2008 – The Intel® Atom™ processor will be the name for a new family of low-power processors designed specifically for mobile Internet devices (MIDs) and a new class of simple and affordable Internet-centric computers arriving later this year. Together, these new market segments represent a significant new opportunity to grow the overall market for Intel silicon, using the Intel Atom processor as the foundation. The company also announced the Intel® Centrino® Atom™ processor technology brand for MID platforms, consisting of multiple chips that enable the best Internet experience in a pocketable device.
The Intel Atom processor is based on an entirely new microarchitecture designed specifically for small devices and low power, while maintaining the Intel® Core™ 2 Duo instruction set compatibility consumers are accustomed to when using a standard PC and the Internet. The design also includes support for multiple threads for better performance and increased system responsiveness. All of this on a chip that measures less than 25 mm², making it Intel's smallest and lowest power processor yet.1 Up to 11 Intel Atom processor die -- the tiny slivers of silicon packed with 47 million transistors each -- would fit in an area the size of an American penny.
These new chips, previously codenamed Silverthorne and Diamondville, will be manufactured on Intel's industry-leading 45nm process with hi-k metal gate technology. The chips have a thermal design power (TDP) specification in 0.6-2.5 watt range and scale to 1.8GHz speeds depending on customer need. By comparison, today's mainstream mobile Core 2 Duo processors have a TDP in the 35-watt range.
"This is our smallest processor built with the world's smallest transistors," said Intel Executive Vice President and Chief Sales and Marketing Officer Sean Maloney. "This small wonder is a fundamental new shift in design, small yet powerful enough to enable a big Internet experience on these new devices. We believe it will unleash new innovation across the industry."
With personal computing increasingly going mobile and the computer industry rapidly developing new classes of products to connect the next billion people to the Internet, the Intel Atom processor offers customers the unique ability to innovate around the new low-power design. In addition to the MID opportunity, Intel believes the demand for a new category of low-cost, Internet-centric mobile computing devices dubbed "netbooks" and basic Internet-centric desktop PCs dubbed "nettops," will grow substantially over the next several years. The Intel Atom processor is perfectly suited to meet these new market segments.
Intel said the Intel Atom processor also has potential for future revenue opportunities in consumer electronic devices, embedded applications and thin clients.
Intel Centrino Atom Processor TechnologyThe Intel Centrino Atom processor technology brand represents Intel's best technology for MIDs. Formerly codenamed "Menlow," Intel Centrino Atom processor technology includes the Intel Atom processor, a low-power companion chip with integrated graphics, a wireless radio, and thinner and lighter designs. Together, these components are designed to enable the best mobile computing and Internet experience on these new devices.
The Intel Atom processor is based on an entirely new microarchitecture designed specifically for small devices and low power, while maintaining the Intel® Core™ 2 Duo instruction set compatibility consumers are accustomed to when using a standard PC and the Internet. The design also includes support for multiple threads for better performance and increased system responsiveness. All of this on a chip that measures less than 25 mm², making it Intel's smallest and lowest power processor yet.1 Up to 11 Intel Atom processor die -- the tiny slivers of silicon packed with 47 million transistors each -- would fit in an area the size of an American penny.
These new chips, previously codenamed Silverthorne and Diamondville, will be manufactured on Intel's industry-leading 45nm process with hi-k metal gate technology. The chips have a thermal design power (TDP) specification in 0.6-2.5 watt range and scale to 1.8GHz speeds depending on customer need. By comparison, today's mainstream mobile Core 2 Duo processors have a TDP in the 35-watt range.
"This is our smallest processor built with the world's smallest transistors," said Intel Executive Vice President and Chief Sales and Marketing Officer Sean Maloney. "This small wonder is a fundamental new shift in design, small yet powerful enough to enable a big Internet experience on these new devices. We believe it will unleash new innovation across the industry."
With personal computing increasingly going mobile and the computer industry rapidly developing new classes of products to connect the next billion people to the Internet, the Intel Atom processor offers customers the unique ability to innovate around the new low-power design. In addition to the MID opportunity, Intel believes the demand for a new category of low-cost, Internet-centric mobile computing devices dubbed "netbooks" and basic Internet-centric desktop PCs dubbed "nettops," will grow substantially over the next several years. The Intel Atom processor is perfectly suited to meet these new market segments.
Intel said the Intel Atom processor also has potential for future revenue opportunities in consumer electronic devices, embedded applications and thin clients.
Intel Centrino Atom Processor TechnologyThe Intel Centrino Atom processor technology brand represents Intel's best technology for MIDs. Formerly codenamed "Menlow," Intel Centrino Atom processor technology includes the Intel Atom processor, a low-power companion chip with integrated graphics, a wireless radio, and thinner and lighter designs. Together, these components are designed to enable the best mobile computing and Internet experience on these new devices.
Intel Lowers First-Quarter Gross Margin Forecast Due to Lower NAND Flash Memory Prices
SANTA CLARA, Calif., March 3, 2008 -- Intel Corporation today lowered its first-quarter gross margin forecast to 54 percent, plus or minus a point, as compared to the previous forecast of 56 percent, plus or minus a couple of points, due to lower than expected prices for NAND flash memory chips. All other expectations are consistent with the first quarter Business Outlook published in the company's fourth quarter 2007 earnings release, available at www.intc.com.
Status of Business OutlookDuring the quarter, Intel's corporate representatives may reiterate the Business Outlook during private meetings with investors, investment analysts, the media and others. From the close of business on March 7 until publication of the company's first-quarter 2008 earnings release, Intel will observe a "Quiet Period" during which the Business Outlook disclosed in the company's press releases and filings with the SEC should be considered to be historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.
Risk FactorsThe above statements and any others in this document that refer to plans and expectations for the first quarter and the future involve a number of risks and uncertainties. Many factors could cause Intel's actual results to differ materially from current expectations, including the following:
Changes in business and economic conditions, including conditions in the credit market that could affect consumer confidence; customer acceptance of Intel's and competitors' products; changes in customer order patterns, including order cancellations; and changes in the level of inventory at customers. Intel's results could be affected by the timing of closing of acquisitions and divestitures.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Additionally, Intel is in the process of transitioning to its next generation of products on 45nm process technology, and there could be execution issues associated with these changes, including product defects and errata along with lower than anticipated manufacturing yields. Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel's response to such actions; Intel's ability to respond quickly to technological developments and to incorporate new features into its products; and the availability of sufficient components from suppliers to meet demand.
The gross margin percentage could vary significantly from expectations based on changes in revenue levels; product mix and pricing; capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; excess or obsolete inventory; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs, including start-up costs.
Expenses, particularly certain marketing and compensation expenses, vary depending on the level of demand for Intel's products, the level of revenue and profits, and impairments of long-lived assets.
Intel is in the midst of a structure and efficiency program that is resulting in several actions that could have an impact on expected expense levels and gross margin. Intel is also in the midst of forming Numonyx, a private, independent semiconductor company, together with STMicroelectronics N.V. and Francisco Partners L.P. A change in the financial performance of the contributed businesses could have a negative impact on our financial statements. Intel's equity proportion of the new company's results will be reflected on its financial statements below operating income and with a one quarter lag. The results could have a negative impact on Intel's overall financial results.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
Gains or losses from equity securities and interest and other could vary from expectations depending on fixed income and equity market volatility; gains or losses realized on the sale or exchange of securities; gains or losses from equity method investments; impairment charges related to marketable, non-marketable and other investments; interest rates; cash balances; and changes in fair value of derivative instruments.
Intel's results could be affected by the amount, type, and valuation of share-based awards granted as well as the amount of awards cancelled due to employee turnover and the timing of award exercises by employees.
Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in the countries in which Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports.
Status of Business OutlookDuring the quarter, Intel's corporate representatives may reiterate the Business Outlook during private meetings with investors, investment analysts, the media and others. From the close of business on March 7 until publication of the company's first-quarter 2008 earnings release, Intel will observe a "Quiet Period" during which the Business Outlook disclosed in the company's press releases and filings with the SEC should be considered to be historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.
Risk FactorsThe above statements and any others in this document that refer to plans and expectations for the first quarter and the future involve a number of risks and uncertainties. Many factors could cause Intel's actual results to differ materially from current expectations, including the following:
Changes in business and economic conditions, including conditions in the credit market that could affect consumer confidence; customer acceptance of Intel's and competitors' products; changes in customer order patterns, including order cancellations; and changes in the level of inventory at customers. Intel's results could be affected by the timing of closing of acquisitions and divestitures.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Additionally, Intel is in the process of transitioning to its next generation of products on 45nm process technology, and there could be execution issues associated with these changes, including product defects and errata along with lower than anticipated manufacturing yields. Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel's response to such actions; Intel's ability to respond quickly to technological developments and to incorporate new features into its products; and the availability of sufficient components from suppliers to meet demand.
The gross margin percentage could vary significantly from expectations based on changes in revenue levels; product mix and pricing; capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; excess or obsolete inventory; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs, including start-up costs.
Expenses, particularly certain marketing and compensation expenses, vary depending on the level of demand for Intel's products, the level of revenue and profits, and impairments of long-lived assets.
Intel is in the midst of a structure and efficiency program that is resulting in several actions that could have an impact on expected expense levels and gross margin. Intel is also in the midst of forming Numonyx, a private, independent semiconductor company, together with STMicroelectronics N.V. and Francisco Partners L.P. A change in the financial performance of the contributed businesses could have a negative impact on our financial statements. Intel's equity proportion of the new company's results will be reflected on its financial statements below operating income and with a one quarter lag. The results could have a negative impact on Intel's overall financial results.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
Gains or losses from equity securities and interest and other could vary from expectations depending on fixed income and equity market volatility; gains or losses realized on the sale or exchange of securities; gains or losses from equity method investments; impairment charges related to marketable, non-marketable and other investments; interest rates; cash balances; and changes in fair value of derivative instruments.
Intel's results could be affected by the amount, type, and valuation of share-based awards granted as well as the amount of awards cancelled due to employee turnover and the timing of award exercises by employees.
Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in the countries in which Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports.
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